产品信息
24 Apr 2024
Read time: 4 minute(s)
型号 | 特性 | 封装 | 温度(Tj) |
---|---|---|---|
D133BAS | 512 KB SRAM 4 MB PSRAM |
QFN68, 7 x 7 x 0.85 mm, 0.35 mm 间距 | -40 至 +105℃ |
D133BBS | 512 KB SRAM 8 MB PSRAM |
QFN68, 7 x 7 x 0.85 mm, 0.35 mm 间距 | -40 至 +105℃ |
D133CBS | 1 MB SRAM 8 MB PSRAM |
QFN88, 10 x 10 x 0.85 mm, 0.4 mm 间距 | -40 至 +105℃ |
D133CCS | 1 MB SRAM 16 MB PSRAM |
QFN88, 10 x 10 x 0.85 mm, 0.4 mm 间距 | -40 至 +105℃ |
D133EBS | 1 MB SRAM 8 MB PSRAM |
QFN100, 12 x 12 x 0.85 mm, 0.4 mm 间距 | -40 至 +105℃ |
D133ECS | 1 MB SRAM 16 MB PSRAM |
QFN100, 12 x 12 x 0.85 mm, 0.4 mm 间距 | -40 至 +105℃ |
D132ENS | 1 MB SRAM | QFN100, 12 x 12 x 0.85 mm, 0.4 mm 间距 | -40 至 +105℃ |
项目 | D133BAS D133BBS |
D133CBS D133CCS |
D133EBS D133ECS |
D132ENS |
---|---|---|---|---|
内核 |
E907 480MHz@1.1 V |
E907 480MHz@1.1 V |
E907 480MHz@1.1 V |
E907 480MHz @1.1 V |
安全 | 支持 | 支持 | 支持 | 支持 |
内置 OSC | 是 | 否 | 否 | 否 |
RGB | x 1 | x 1 | x 1 | x 1 |
LVDS | x 1 | x 1 | x 1 | - |
MIPI DSI | x 1 | x 1 | x 1 | x 1 |
RTP | x 1 | x 1 | x 1 | x 1 |
DVP | - | x 1 | x 1 | x 1 |
RTC | - | x 1 | x 1 | x 1 |
SD3.01 | x 1 | x 1 | x 1 | x 1 |
eMMC 4.41/ SDIO 3.0 | x 1 | x 1 | x 1 | x 1 |
DMIC | x 2 | x 2 | x 2 | x 2 |
I2S | x 1 | x 1 | x 1 | x 1 |
DSPK | x 2 | x 2 | x 2 | x 2 |
QSPI | x 3 | x 3 | x 3 | x 3 |
SPI | x 1 | x 1 | x 1 | x 1 |
UART | x 8 | x 8 | x 8 | x 8 |
I2C | x 3 | x 3 | x 3 | x 3 |
CAN | x 1 | x 1 | x 2 | x 2 |
CIR | x 1 | x 1 | x 1 | x 1 |
EMAC-100M | - | x 1 | x 1 | x 1 |
USB2.0 | - | x 1 | x 1 | x 1 |
PWM | x 4 (8 ch) | x 4 (8 ch) | x 4 (8 ch) | x 4 (8 ch) |
EPWM | x 12 (24 ch) | x 12 (24 ch) | x 12 (24 ch) | x 12 (24 ch) |
CAP | x 6 | x 6 | x 6 | x 6 |
ADC | x2 (10 ch) | x2 (10 ch) | x2 (12 ch) | x2 (12 ch) |